product details dimension a dimension b dimension c dimension d interface material finish notes: d imension c = heat sink height from bottom of the base to the top of the fn feld. thermal performance data are provided for reference only. actual performance may vary by application. ats reserves the right to update or change its products without notice to improve the design or performance. optional maxigrip? installation/removal tool set p/n: mgt400 contact ats to learn about custom options available. 1) 2) 3) 4) 5) 6) t hermal performance for more information, to fnd a distributor or to place an order, visit www.qats.com or call: 781.769.2800 (north america); +31 (0) 3569 84715 (europe). ats part # ATS-53400K-C2-R0 features & benefts high performance bga cooling solutions w/ maxigrip? attachment rev1_0908 air velocity thermal r esistance ft/min m/s c/w (unducted flow) c/w (ducted flow) 200 1.0 300 1.5 400 2.0 500 2.5 600 3.0 700 3.5 800 4.0 4.6 3.3 2.8 2.5 2.2 2.1 1.9 2.4 40 mm 40 mm 14.5 mm 40 mm black-anodized saint -gobain c675 high aspect ratio, straight fin heat sinks that are ideal for compact pcb environments maxigrip? attachment applies steady, even pressure to the component and does not require holes in the pcb designed specifically for bgas and other surface mount packages meets telcordia gr-63-core office vibration; etsi 300 019 transportation vibration; and mil-std-810 shock testing and unpackaged drop testing standards comes preassembled with high performance thermal interface material ? ? ? ? ? c b a d *image above is for illustration purposes only.
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